Comparison of CDM and CC-TLP robustness for an ultra-high speed interface IC

Challenging the limits of todays metrology and test setups for CDM and Capacitively Coupled Transmission Line Pulsing (CC-TLP), the study identifies critical stress parameters for a 25 Gbps communication device in the CDM-domain. Only CC-TLP stress in combination with a 33/63 GHz single shot oscilloscope was able to relate significant differences of failure current distributions to the rise time spread in the order of few tens of picoseconds and to obtain a conclusive sharp pass/fail transition at a certain peak current level.