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Tungsten- and molybdenum-copper alloys for microelectronic packaging
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2000
Conference Paper
Title
Tungsten- and molybdenum-copper alloys for microelectronic packaging
Title Supplement
Processing via metal-injection-moulding (MIM)
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Author(s)
Knüwer, M.
Wichmann, K.-H.
Meinhardt, M.
Mainwork
Tungsten, hard metals and refractory alloys 5
Conference
International Conference on Tungsten, Hard Metals, and Refractory Alloys 2000
Language
English
Fraunhofer-Institut für Fertigungstechnik und Angewandte Materialforschung IFAM
