Detection and analysis of stress-induced voiding in Al-power lines by acoustic GHz-microscopy

The formation of voids in metal layers upon stress-induced migration is a well-known defect mechanism in integrated circuits. This phenomenon largely accelerates with increasing ambient temperature. Consequently, the occurrence and the growth of voids result in an increased electrical resistivity which once more leads to an acceleration of the growth rate highly impacting the reliability and the life span of the device. Technological improvements aim at the minimization of stress induced voiding. However, for understanding and optimization of process related factors non-destructive methods for screening and systematic monitoring of the void formation e.g. during stepwise reliability testing are required. In the current paper, the formation of voids induced by repetitive thermal loads has been assessed and evaluated semi-destructively by employing Scanning Acoustic GHz-Microscopy.