Modelling of sputter erosion rate enhancement from ceramic targets

Sputter deposition of ceramic films (oxides, nitrides, etc.) can either be carried out by sputtering from a metallic target with an addition of a reactive gas, or by sputtering from a ceramic target. In the latter case it is common to add some reactive gas to ensure the formation of stoichiometric films. There are several reports about deposition with a surprisingly high rate from ceramic targets as compared to traditional reactive sputtering from a metallic target in the poisoned mode. The reason for this is not fully understood. However, we present a model that describes the observed behavior. In this model, one of the assumptions in the original Berg's model has been changed. Previously, we assumed that the compound formed at the target surface is sputtered in the form of molecules. However, it is commonly accepted that most sputtered particles are elemental atoms. Therefore, we assume that the different elements constituting the compound are sputtered as single atom s with different yields. The new model closely describes reported system behavior and may also be used for further studies of this kind of process.