Nano-Particle Filled Epoxy Resins with Improved Diffusion Barrier Functionality

Epoxy resins are widely used in micro¬electronics packaging. But like all poly¬mers they can not provide a her-metical sealing due to their permeabil-ity properties. Water inside a micro-electronic package might lead to sof-tening of the material and to a decreas-ing adhesive strength and resulting delaminations close to solder bumps or wire bonds reducing package reliability. The incorporation of nano-particles into plastic packaging materials is discussed as one potential solution for improved humidity resistance, barrier enhancement and decreased humidity uptake properties. To evaluate the potential of such additives the effect of nano-particles mixed with a microelec-tronic grade epoxy resin is studied. This work mainly focuses on three different types with assumed different working principles: nano-sized silica, bentonites and zeolites. Experimental work is accompanied by simulations in order to provide further qualitative understanding on effects of particle form, size and surface properties.