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Characterization and modelling of solder joint reliability
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2006
Book Article
Title
Characterization and modelling of solder joint reliability
Author(s)
Dudek, R.
Mainwork
Mechanics of microelectronics
DOI
10.1007/1-4020-4935-8_7
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
