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Development and characterization of Cu to Cu bonding technology
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2007
Conference Paper
Title
Development and characterization of Cu to Cu bonding technology
Author(s)
Baum, M.
Letsch, H.
Shaporin, A.V.
Otto, T.
Gessner, T.
Mainwork
Smart systems integration 2007
Conference
European Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components 2007
Language
English
Fraunhofer-Institut für Elektronische Nanosysteme ENAS
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
