• English
  • Deutsch
  • Log In
    Password Login
    Research Outputs
    Fundings & Projects
    Researchers
    Institutes
    Statistics
Repository logo
Fraunhofer-Gesellschaft
  1. Home
  2. Fraunhofer-Gesellschaft
  3. Konferenzschrift
  4. SiCmodul - Modular high-temperature SiC power electronics for fail-safe power control in electrical drive engineering
 
  • Details
  • Full
Options
2020
Conference Paper
Title

SiCmodul - Modular high-temperature SiC power electronics for fail-safe power control in electrical drive engineering

Abstract
The application of silicon carbide semiconductors in combination with high-temperature compatible materials allows for increased switching speeds and improved power densities in future power electronic systems. Further, it is expected that the component requirements regarding the reliability increase, while the failure proneness is reduced. To achieve these goals, the fundamental requirements are an optimized system design and robust interconnection technologies, which are addressed as main objectives in the publicly funded research project SiCmodul. The consortium members realize an advanced traction inverter, which is scalable in power and features a power stage that is operational at temperatures of up to 200 °C. Hence, the inverter will be directly mounted to the electric motor, yielding a more compact and efficient power unit. Furthermore, tasks on intelligent motor control, failure detection, thermal optimizations and reliability investigations are passed.
Author(s)
Marczok, C.
Martina, M.
Laumen, M.
Richter, S.
Birkhold, A.
Flieger, B.
Wendt, O.
Päsler, T.
Mainwork
CIPS 2020, 11th International Conference on Integrated Power Electronics Systems. Proceedings  
Conference
International Conference on Integrated Power Electronics Systems (CIPS) 2020  
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
  • Cookie settings
  • Imprint
  • Privacy policy
  • Api
  • Contact
© 2024