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Damage and failure analysis of lead-free solder interconnects in automotive electronics
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2005
Conference Paper
Title
Damage and failure analysis of lead-free solder interconnects in automotive electronics
Title Supplement
Abstract
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Author(s)
Faust, W.
Kreyßig, K.
Michel, B.
Mainwork
MicroCar 2005. Micro materials, nano materials for automotives. Volume of Abstracts
Conference
Fachkongress MicroCar 2005
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
