English
Deutsch
Log In
Log in with Fraunhofer Smartcard
Password Login
Have you forgotten your password?
Research Outputs
Fundings & Projects
Researchers
Institutes
Statistics
Fraunhofer-Gesellschaft
Home
Fraunhofer-Gesellschaft
Artikel
Low profile and flexible electronic assemblies using ultra-thin silicon - the european Flex-Si projekt
Details
Full
Export
Statistics
Options
Show all metadata (technical view)
2003
Book Article
Title
Low profile and flexible electronic assemblies using ultra-thin silicon - the european Flex-Si projekt
Author(s)
Harder, T.
Mainwork
Foldable flex and thinned silicon multichip packaging technology
Language
English
Fraunhofer-Institut für Siliziumtechnologie ISIT
