DTIP 2015, 17th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS

2015

Conference Proceeding

Person Involved

Benoit, Charlot

IES, University of Montpellier, France

Mita, Yoshio

University of Tokyo, Japan

Nouet, Pascal

LIRMM, University of Montpellier, France

Pressecq, Francis

CNES, France

Schröpfer, Gerold

Conventor, France

Rencz, Marta

BME, Hungary

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

IEEE Components, Packaging, and Manufacturing Technology Society

Publisher

Publishing Place

Piscataway, NJ

Conference