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1994
Conference Paper
Title
Debonding of adhesively joined electronic circuits to the purpose of recycling.
Other Title
Entstücken von klebtechnisch gefertigten Leiterplatten zum Zwecke des Recyclings
Abstract
The need of solder replacement is discussed from the ecological point of view. Electrically conductive adhesives are at the moment the best alternative. In the article is shown, that the methods to debond soldered electronic circuits for the purpose of recycling or repair are usable for adhesively bonded circuits, too.