• English
  • Deutsch
  • Log In
    Password Login
    Research Outputs
    Fundings & Projects
    Researchers
    Institutes
    Statistics
Repository logo
Fraunhofer-Gesellschaft
  1. Home
  2. Fraunhofer-Gesellschaft
  3. Konferenzschrift
  4. Ultra flat "mounted" Electronics
 
  • Details
  • Full
Options
2006
Conference Paper
Title

Ultra flat "mounted" Electronics

Abstract
The paper proposes a method to place encapsulated devices with a size of typically 100μm micro capsules of this size can be fabricated in batch processes, and they can be dispensed or printed by coarse screen printing techniques. The electric properties of a desired element are roughly defined by the printing pattern, not by the single micro capsule: This means a lot of capsules form a single device. In order to provide an oriented deposition, as necessary in case of polarization dependent deposition, a magnetic alignment is proposed.
Author(s)
Haberger, Karl
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Feil, Michael
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Mainwork
1st Electronics Systemintegration Technology Conference, ESTC 2006. Vol.2  
Conference
Electronics Systemintegration Technology Conference (ESTC) 2006  
DOI
10.1109/ESTC.2006.280187
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
  • Cookie settings
  • Imprint
  • Privacy policy
  • Api
  • Contact
© 2024