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The development of a low cost wafer level bumping technique
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2004
Conference Paper
Title
The development of a low cost wafer level bumping technique
Author(s)
Whitmore, M.
Staddon, M.
Manessis, D.
Mainwork
International Wafer-Level Packaging Congress, IWLPC 2004. CD-ROM
Conference
International Wafer-Level Packaging Congress (IWLPC) 2004
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
