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  4. Flip-chip mounted 1:4 demultiplexer IC in InP DHBT technology operating up to 100 Gb/s
 
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2007
Conference Paper
Title

Flip-chip mounted 1:4 demultiplexer IC in InP DHBT technology operating up to 100 Gb/s

Abstract
Operation of a packaged 1:4 demultiplexer (DEMUX) in InP DHBT technology for an input data rate of up to 100 Gb/s is presented. The DEMUX IC is flip-chip mounted in a microwave package consisting of an aluminum nitride substrate with coplanar waveguides placed in a Kovar/MoCu housing with coaxial V-connectors. The DEMUX was operated at a supply voltage of -3.5 V and consumes 2.1 W.
Author(s)
Kärnfelt, C.
Hallin, J.
Kjellberg, T.
Hansson, B.
Swahn, T.
Mainwork
2nd European Microwave Integrated Circuits Conference, EuMIC 2007  
Conference
European Microwave Integrated Circuit Conference (EuMIC) 2007  
DOI
10.1109/EMICC.2007.4412714
Language
English
Fraunhofer-Institut für Techno- und Wirtschaftsmathematik ITWM  
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