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Packaging and interconnection techniques for microsystems
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1993
Conference Paper
Title
Packaging and interconnection techniques for microsystems
Author(s)
Reichl, H.
Mainwork
International Conference on Systems, Man and Cybernetics '93. Proceedings. Vol.4
Conference
International Conference on Systems, Man and Cybernetics (SMC) 1993
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
