Introducing a Reference Flow for Chip-Package Co-Design for 5G / MM-Wave Designs on GF ADK for 22FDX

This talk is presenting a reference flow for a chip-package co-design. The technology used, is a 22FDx IC-technology combined with a two-level package technology. The application case is data transfer at 60GHz for 5G. To cope with the requirements of such a system an Assembly Design Kit (ADK) is necessary to enable co-design.