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Copper and copper oxide composite films deposited by ALD on tantalum-based diffusion barriers
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2008
Conference Paper
Title
Copper and copper oxide composite films deposited by ALD on tantalum-based diffusion barriers
Author(s)
Wächtler, T.
Oswald, S.
Pohlers, A.
Schulze, S.
Schulz, S.E.
Gessner, T.
Mainwork
Advanced Metallization Conference, AMC 2007
Conference
Advanced Metallization Conference (AMC) 2007
Language
English
Fraunhofer-Institut für Elektronische Nanosysteme ENAS
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM