Requirements of power supply parameters for high-power pulsed magnetron sputtering

In the last few years a new sputter process technology called Pulsed Magnetron Sputtering (PMS) was developed and has become a relevant factor for industrial applications in large area coating. Combination of pulsed power supply and Dual Magnetron Sputter (DMS) system enables the deposition of insulating layers like Al2O3, SiO2, ZnO and SnO2 with high rates as DC sputtering. PMS process in conjunction with high power density requires intelligent process and arc management. The interactions between process control and dynamics of power supply are described by means of the deposition of tin oxide and zinc oxide. In result of optimization of the system power supply-sputter source is a long-term stable deposition process.