Interaction between electronic pastes and AlN-substrate.

Electronic pastes (resistors, conductors, dielectrics) on AlN-ceramics are far reactive systems than on Al2O3-ceramics; frequently it is observed, that pastes bubble during firing, because gaseous products cannot escape the layer. Therefore an important task of the paste development is to find bubble-free range by appropriate variation of the powder properties to get a tool for production-technological controlling. Using non-reducible glasses we get the best results. But chemical reactions can be desirable between the glass of the conductor paste and AlN to increase the adhesion of the layer in the aged state.