Next generation system in a package manufacturing

The continuous miniaturization of silicon dies and the need for a further package size reduction, with an equal or better performance and reduced manufacturing cost, are the main drivers for new packaging concepts. The embedding of active and passive components offers a wide range of benefits and potentials. With the use of laminate based technology concepts, components can be moved from surface mount into the build-up layers of substrates by embedding and by that, the third dimension will be available for further layers or assemblies. This paper will illustrate the necessary process steps of the embedded chip technology, which is based on printed circuit board manufacturing processes, and will also demonstrate the transfer of the technology from a smaller size lab scale equipment environment to an industrial comparable process line, capable of processing large panel formats up to 18? x 24?. Furthermore results of technology developments toward ultra-fine line and ultra-fine pitch will be presented.