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Measurement of the local strength distribution of directly bonded silicon wafers using the micro-chevron-test
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2001
Conference Paper
Title
Measurement of the local strength distribution of directly bonded silicon wafers using the micro-chevron-test
Author(s)
Bagdahn, J.
Petzold, M.
Plößl, A.
Wiemer, M.
Mainwork
Semiconductor wafer bonding. Science, technology, and applications V
Conference
International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications 1999
Language
English
Fraunhofer-Institut für Elektronische Nanosysteme ENAS
Fraunhofer-Institut für Werkstoffmechanik IWM
