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Power Modules with Increased Power Density and Reliability Using Cu Wire Bonds on Sintered Metal Buffer Layers
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2014
Conference Paper
Title
Power Modules with Increased Power Density and Reliability Using Cu Wire Bonds on Sintered Metal Buffer Layers
Author(s)
Rudzki, J.
Osterwald, F.
Becker, M.
Eisele, R.
Poech, M.H.
Mainwork
CIPS 2014, 8th International Conference on Integrated Power Electronics Systems. Proceedings
Conference
International Conference on Integrated Power Electronics Systems (CIPS) 2014
Language
English
Fraunhofer-Institut für Siliziumtechnologie ISIT
