• English
  • Deutsch
  • Log In
    Password Login
    Research Outputs
    Fundings & Projects
    Researchers
    Institutes
    Statistics
Repository logo
Fraunhofer-Gesellschaft
  1. Home
  2. Fraunhofer-Gesellschaft
  3. Konferenzschrift
  4. Sintering of conductive inks on plastic substrates by use of microwave furnaces being suitable for largescale production processes
 
  • Details
  • Full
Options
2021
Conference Paper
Title

Sintering of conductive inks on plastic substrates by use of microwave furnaces being suitable for largescale production processes

Abstract
This work is about the application of large-scale microwave furnaces being suitable for the sintering of conductive structures deposited on standard plastic parts in industrial processes. The conductive structures are consisting of carbon or silver filled conductive inks. The feasibility of microwave sintering is proved by comparing the specific resistance of structures subjected to microwave sintering with conductive paths on reference samples sintered in a convection furnace. Furthermore, optical microscopy has been employed to inspect the surface morphology of conductive paths sintered by both microwave furnace and convection furnace. It turns out that appropriate microwave sintering depends on the specific way the magnetron power is controlled in the furnace and on the temporal evolution of magnetron power during the sintering process.
Author(s)
Hartmann, Lutz  
Fraunhofer-Institut für Angewandte Polymerforschung IAP  
Sabban, Jakob  
Fraunhofer-Institut für Angewandte Polymerforschung IAP  
Behrendt, Felix
TH Wildau
Tatai, Tiberiu-Mihai  
Fraunhofer-Institut für Angewandte Polymerforschung IAP  
Neermann, Simone
FAU Erlangen Nuremberg
Franke, Jörg
FAU Erlangen Nuremberg
Dreyer, Christian
TH Wildau
Mainwork
14th International Congress Molded Interconnect Devices, MID 2021. Scientific Proceedings  
Project(s)
Sintern gedruckter leitfähiger Strukturen durch Energieeintrag mittels Mikrowellenbestrahlung
Funder
Bundesministerium für Wirtschaft und Energie  
Conference
International Congress Molded Interconnect Devices (MID) 2021  
DOI
10.1109/MID50463.2021.9361626
Language
English
Fraunhofer-Institut für Angewandte Polymerforschung IAP  
Keyword(s)
  • microwave sintering

  • specific resistance

  • conductive ink

  • electromagnetic simulation

  • conductivity

  • GFRP

  • Cookie settings
  • Imprint
  • Privacy policy
  • Api
  • Contact
© 2024