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Strength assessment of wafer-bonded micromechanical components using the micro-chevron-test
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2001
Conference Paper
Title
Strength assessment of wafer-bonded micromechanical components using the micro-chevron-test
Author(s)
Petzold, M.
Knoll, H.
Bagdahn, J.
Mainwork
Reliability, Testing, and Characterization of MEMS and MOEMS Conference
Conference
Reliability, Testing, and Characterization of MEMS and MOEMS Conference 2001
DOI
10.1117/12.442994
Language
English
Fraunhofer-Institut für Werkstoffmechanik IWM
