2006
Conference Paper
Title

Fatigue Life Prediction and Analysis of Wafer Level Packages with SnAgCu Solder Balls

Author(s)
Dudek, R.
Rzepka, S.
Dobritz, S.
Döring, R.
Kreißig, K.
Wiese, S.
Michel, B.
Mainwork
Conference
Language
English