2000
Conference Paper
Title

Comparison of flip chip technologies on rigid polyimide with respect to reliability and manufacturing costs

Author(s)
Mießner, R.
Aschenbrenner, R.
Reichl, H.
Ling, S.
Le, B.
Lew, A.
Benson, R.
Nhan, E.
Mainwork
Conference
DOI
Language
English