Ultrafast laser micromachining using wavelengths from ∼0.2µm to ∼2µm

We review micromachining strategies with optimized energy deposition from ultrafast lasers operating with wavelengths from 1980 nm down to 257 nm. By discussing multifarious machining concepts, such as, e.g., in-volume silicon processing (NIR), drilling of fine-metal masks (green), or cutting of polymer foils (DUV), we show how processing benefits from adapted photon energies or tighter foci. In all cases, an optimized processing solution is achieved precisely when light source, beam shaping and focusing concept are tailored to each other and to the respective light-material interaction.