Mask and plate: a scalable front metallization with low-cost potential for III-V-based tandem solar cells enabling 31.6 % conversion efficiency

Low-cost approaches for mass production of III-V-based photovoltaics are highly desired today. For the frst time, this work presents industrially relevant mask and plate for front metallization of III–V-based solar cells replacing expensive photolithography. Metal contacts are fabricated by nickel (Ni) electroplating directly onto the solar cell’s front using a precisely structured mask. Inkjet printing ofers low-cost and high-precision processing for application of an appropriate plating resist. It covers the solar cell’s front side with narrow openings for subsequent electroplating. The width of the resulting Ni contacts is as low as (10.5 ± 0.8) µm with sharp edges and homogenous shape. The 4 cm²-sized champion III-V-on-silicon triple-junction solar cell with mask and plate front metallization reaches a certifed conversion efciency η of (31.6 ± 1.1) % (AM1.5 g spectrum). It performs just as well as the reference sample with photolithography-structured evaporated front contacts, which reaches η= (31.4 ± 1.1) %.