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Fabrication Challenges of 3D Integration Technologies for More Than Moore Applications
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2008
Conference Paper
Title
Fabrication Challenges of 3D Integration Technologies for More Than Moore Applications
Author(s)
Ramm, P.
Taklo, M.M.V.
Mainwork
Twenty Fifth International VLSI Multilevel Inerconnection Conference (VMIC) 2008. Proceedings
Conference
International VLSI Multilevel Interconnection Conference (VMIC) 2008
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
