2015
Conference Paper
Title

Thin wafer handling using mechanical- or laser-debondable temporary adhesives

Author(s)
Fleming, D.
Kim, J.-U.
Okada, J.
Wang, K.
Gallagher, M.
Barr, B.
Calvert, J.
Zoschke, K.
Wegner, M.
Töpper, M.
Rapps, T.
Griesbach, T.
Lutter, S.
Mainwork
Conference
Language
English