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Advanced flip chip encapsulation: Transfer molding process for simultaneous underfiling and postencapsulation
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2001
Conference Paper
Title
Advanced flip chip encapsulation: Transfer molding process for simultaneous underfiling and postencapsulation
Author(s)
Becker, K.-F.
Braun, T.
Koch, M.
Ansorge, F.
Aschenbrenner, R.
Reichl, H.
Mainwork
Polytronic 2001, International Conference on Polymers and Adhesives in Microelectronics and Photonics. Proceedings
Conference
International Conference on Polymers and Adhesives in Microelectronics and Photonics (Polytronic) 2001
DOI
10.1109/POLYTR.2001.973270
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
