2015
Conference Paper
Title

Application of polyelectrolyte multilayers for temporary wafer bonding

Title Supplement
Abstract
Abstract
Polyelectrolyte multilayers (PEMs) deposited via layer-by-layer technique can be used as interfacial layers for temporary wafer bonding. Depending on the PEM combination appropriate bond strength as well as reduction of surface energy to facilitate debonding of wafer pairs can be achived at different annealing tempreatures.
Author(s)
Dillmann, H.
Eichler, M.
Klages, C.-P.
Mainwork
Conference
Language
English