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Packaging for high frequency and reliability
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2018
Journal Article
Title
Packaging for high frequency and reliability
Author(s)
Folk, E.
Ndip, I.
Journal
Advancing microelectronics
Open Access
Link
Link
DOI
10.4071/2380-7016-45.2.1
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
