English
Deutsch
Log In
Password Login
or
Log in with Fraunhofer Smartcard
Research Outputs
Projects
Researchers
Institutes
Statistics
Fraunhofer-Gesellschaft
Home
Fraunhofer-Gesellschaft
Artikel
Packaging for high frequency and reliability
Details
Full
Export
Statistics
Options
2018
Journal Article
Titel
Packaging for high frequency and reliability
Author(s)
Folk, E.
Ndip, I.
Zeitschrift
Advancing microelectronics
DOI
10.4071/2380-7016-45.2.1
Externer Link
Externer Link
Language
English
google-scholar
View Details
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
