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Reliability evaluation of chip scale packages by FEA and MicroDAC
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1997
Conference Paper
Title
Reliability evaluation of chip scale packages by FEA and MicroDAC
Author(s)
Auersperg, J.
Vogel, D.
Simon, J.
Schubert, A.
Michel, B.
Mainwork
Design and reliability of solders and solder interconnections 1997. Proceedings of a symposium held during the TMS Annual Meeting
Conference
Solder Joint Symposium 1997
TMS Annual Meeting 1997
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
