Evaluating Multi-Chiplet Integration of Automotive Radar System-In-Packages in eWLB and RDL-first

This work demonstrates heterogeneous integration of a 76-77 GHz 4x4 radar system in package using two advanced packaging technologies, Infineon's embedded wafer-level ball grid array (eWLB) and Fraunhofer IZM's redistribution line (RDL)-first. Both package designs employ identical designs aside from PCB and chiplet interfaces, enabling a direct performance comparison between their thermomechanical reliability and electromagnetic performance. The analysis further highlights the importance of chiplet-package co-design by addressing potential package degradation mechanisms. Both 7.8 x 8.8 mm2 packages were validated with MIMO measurements in the same measurement environment and under similar conditions. Within the 37 m measurement environment, a successful target detection with both SiPs was achieved unambiguously with at least ±16° azimuth resolution.