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  4. Electrons Vs. Photons: Assessment of Circuit's Activity Requirements for E-Beam and Optical Probing Attacks
 
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2023
Conference Paper
Title

Electrons Vs. Photons: Assessment of Circuit's Activity Requirements for E-Beam and Optical Probing Attacks

Abstract
Contactless probing methods through the chip backside have been demonstrated to be powerful attack techniques in the field of electronic security. However, these attacks typically require the adversary to run the circuit under specific conditions, such as enforcing the switching of gates or registers with certain frequencies or repeating measurements over multiple executions to achieve an acceptable signal-to-noise ratio (SNR). Fulfilling such requirements may not always be feasible due to challenges such as low-frequency switching or inaccessibility of the control signals. In this work, we assess these requirements for contactless electron- and photon-based probing attacks by performing extensive experiments. Our findings demonstrate that E-beam probing, in particular, has the potential to outperform optical methods in scenarios involving static or low-frequency circuit activities.
Author(s)
Amini, Elham
Kiyan, Tuba
Renkes, Lars
Krachenfels, Thilo
Boit, Christian
Seifert, Jean-Pierre
Jatzkowski, Jörg
Fraunhofer-Institut für Mikrostruktur von Werkstoffen und Systemen IMWS  
Altmann, Frank  
Fraunhofer-Institut für Mikrostruktur von Werkstoffen und Systemen IMWS  
Brand, Sebastian
Fraunhofer-Institut für Mikrostruktur von Werkstoffen und Systemen IMWS  
Tajik, Shahin
Mainwork
ISTFA 2023, 49th International Symposium for Testing and Failure Analysis. Conference Proceedings  
Conference
International Symposium for Testing and Failure Analysis 2023  
DOI
10.31399/asm.cp.istfa2023p0339
Language
English
Fraunhofer-Institut für Mikrostruktur von Werkstoffen und Systemen IMWS  
Keyword(s)
  • contactless electron probing

  • electron-beam probing

  • electronic security

  • optical methods

  • optical probing attacks

  • photon probing

  • signal-to-noise ratio

  • Non-Destructive Defect Localization

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