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1997
Conference Paper
Title

New developments of the ELYMAT technique

Abstract
Injection level analysis of bulk recombination lifetime in silicon wafers with the ELYMAT technique has become possible through the development of high-stability semiconductor laser diode modules with digitally tunable optical output power. This allows for the identification of the chemical nature of dominant recombination centers such as iron and other dissolved metals, and oxygen precipitates. Metal silicide precipitates in the surface layer are quantitatively related to the surface recombination velocity which can be obtained using two lasers with distinctly different absorption depths in silicon (two-color technique).
Author(s)
Eichinger, P.
Rommel, M.  orcid-logo
Mainwork
Symposium on Crystalline Defects and Contamination 1997. Proceedings. Their impact and control in device manufacturing II  
Conference
Symposium on Crystalline Defects and Contamination 1997  
Electrochemical Society (Meeting) 1997  
Language
English
IIS-B  
Keyword(s)
  • carrier lifetime

  • elemental semiconductors

  • minority carrier

  • passivation

  • silicon

  • surface recombination

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