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Simulation Based Analysis of Secondary Effects on Solder Fatigue
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2009
Conference Paper
Titel
Simulation Based Analysis of Secondary Effects on Solder Fatigue
Author(s)
Dudek, R.
Doering, R.
Bombach, C.
Michel, B.
Hauptwerk
Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems, EuroSimE 2008
Konferenz
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE) 2008
DOI
10.1109/ESIME.2008.4525072
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM