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  4. Pattern-based integrative design of molded interconnect devices (MID)
 
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2012
Conference Paper
Title

Pattern-based integrative design of molded interconnect devices (MID)

Author(s)
Dumitrescu, Roman  
Gaukstern, Tobias
Jürgenhake, Christoph
Gausemeier, Jürgen
Kühn, Arno
Mainwork
Proceedings of DESIGN 2012. Vol.3  
Conference
International Design Conference (DESIGN) 2012  
Language
English
Fraunhofer-Institut für Produktionstechnologie IPT  
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