Monolithic integration of MOEMS on CMOS backplanes using surface micromachining techniques

A new generation of spatial light modulators (SLM) is being developed based on SiO2 sacrificial layer technology and multilevel actuator design. In this paper, we will present general requirements of monolithic integration of MOEMS structures on CMOS backplanes, advantages of used SiO2 sacrificial layer process and new structural MEMS material used to achieve long-term stable operation of high reflective mirrors. This sophisticated micromachining technology will be demonstrated presenting actual spatial light modulator developments and key parameters of these devices.