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An approach of numerical multi-objective optimization in stacked packaging
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2008
Conference Paper
Title
An approach of numerical multi-objective optimization in stacked packaging
Author(s)
Dowhán, L.
Wymyslowski, A.
Dudek, R.
Mainwork
Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems, EuroSimE 2007
Conference
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE) 2007
DOI
10.1016/j.microrel.2008.04.010
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
