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  4. 35 nm metamorphic HEMT MMIC technology
 
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2008
Conference Paper
Title

35 nm metamorphic HEMT MMIC technology

Other Title
35 nm metamorphe HEMT MMIC Technologie
Abstract
A metamorphic high electron mobility transistor (mHEMT) technology featuring 35 nm gate length has been developed. The optimized MBE grown layer sequence has a channel mobility and a channel electron density as high as 9800 cm2/Vs and 6.1x10(exp 12) cm-2, respectively. To enable a maximum extrinsic transconductance g(ind m, max) of 2500 mS/mm the source resistance has been reduced to 0.1 ohm mm. An f(ind t) of 515 GHz was achieved for a 2 x 10 µm device. Based on this advanced 35 nm mHEMT technology very compact single-stage H-band amplifiers circuits have been realized demonstrating a high small-signal gain of more than 7 dB at 270 GHz.
Author(s)
Leuther, Arnulf  
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Tessmann, Axel  
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Massler, Hermann
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Lösch, R.
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Schlechtweg, M.
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Mikulla, Michael  
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Ambacher, Oliver  
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Mainwork
20th International Conference on Indium Phosphide and Related Materials, IPRM 2008  
Conference
International Conference on Indium Phosphide and Related Materials (IPRM) 2008  
DOI
10.1109/ICIPRM.2008.4702910
Language
English
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Keyword(s)
  • MHEMT

  • InGaAs/InAlAs heterostructure

  • InGaAs/InAlAs Heterostruktur

  • S-MMIC

  • submillimeter-wave monolithic integrated circuit

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