Thermal effects of CO2 snow jet cleaning on PCB functionality and its role in sustainable electronics refurbishment

As the demand for sustainable manufacturing technologies increases, the cleaning of electronic components has gained significant attention, especially in the context of refurbishment processes. This study investigates the use of CO2 snow jet cleaning and the induced thermal response of workpieces subjected to CO2 snow jet cleaning as well as ways of influencing the thermal response through adjustment of process parameters. The primary focus is on understanding the thermal influences CO2 snow jet cleaning exerts on workpieces. The primary objective is to develop processes suitable for application on temperature sensitive parts such as printed circuit boards (PCBs) and various electronic components in manufacturing or refurbishment value chains. Through a series of controlled experiments, the study examines the workpiece cooling induced by CO2 snow jet cleaning. Controlling the thermal influence is crucial for refurbishment processes aimed at extending the lifespan of electronic devices while adhering to sustainability principles. Through adjustments to the jet angle α, capillary diameter dk, stand off distance s and traversing speed vf the area of influence Aoi can be changed in position and shape while also increasing the minimum workpiece temperature ϑw. As such, through specific adjustments of process parameters and pathing, temperature sensitive parts can be protected. Furthermore, this research highlights the alignment of CO2 snow jet cleaning technology with the Sustainable Development Goals (SDGs) of the United Nations (UN). By quantifying the temperature fluctuations experienced by parts subjected to CO2 snow jet cleaning manufacturers can better evaluate the viability of CO2 snow jet cleaning in specific process chains.