Out-of-plane coupling using thin glass based arrayed waveguide components

Nano-photonics and electrical-optical integration are rapidly growing fields with a strong potential for applications in a wide spectrum covering optical sensing, data & telecommunication. Its merit of ultra compactness and planarity becoming a challenge since the periphery remained micro-level and out-of-plane coupling becomes necessary. We introduce new planar optical coupling elements for electrical-optical circuit boards, sensors and nano-devices. The novel photonic packaging technology using thin glass foils bridge the growing field of nano-photonics to the micro-photonic periphery. Innovative features are added to this technique to leverage its generic usage and first experimental results are presented.