2000
Conference Paper
Title

Numerical and experimental investigations of large IC flip chip attach

Abstract
A study was conducted to investigate the reliability of large FCOB assemblies through both thermal cycling tests and numerical simulation. Samples with IC sizes from 10 mm to 40 mm were prepared and subjected to thermal cycling (AATC -55°C/+125°C0 to verify the simulation results with the experimental findings.
Author(s)
Schubert, A.
Dudek, R.
Leutenbauer, R.
Coskina, P.
Becker, K.-F.
Kloeser, J.
Michel, B.
Reichl, H.
Baldwin, D.
Qu, J.
Sitaraman, S.
Wong, C.P.
Tummala, R.
Mainwork
Conference
Language
English