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Gold ball bumps for adhesive flip chip assembly
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1994
Conference Paper
Title
Gold ball bumps for adhesive flip chip assembly
Author(s)
Aschenbrenner, R.
Gwiasda, J.
Eldring, J.
Zakel, E.
Reichl, H.
Mainwork
Adhesives in Electronics '94. First International Conference on Adhesive Joining Technology in Electronics Manufacturing
Conference
International Conference on Adhesive Joining Technology in Electronics Manufacturing 1994
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
