Challenges and advances in back-side metallization

In today's market, crystalline silicon wafer technology dominates industrial solar cell production. Common devices feature opposing electrodes that are situated at the front and rear surface of the wafer and subsequent front-to-rear interconnection is used for module assembly. This paper reflects the functions which have to be fulfilled for the backside contact of the solar cell as well as challenges and advances for the two basic classes: full-area and local rear contact formation. While full-area contacting has proven to be a reliable technology for industrial production, local contacting through dielectric layers has yet to be put through its paces in industrial implementation.