Dynamic analyses of membranes and thin films on wafer level

In this paper a method is described that can be applied for the non-destructive characterisation of micromechanical structures. This method can be used to inspect membranes and thin films on wafer level and is based on a combination of dynamic measurements via a laser-Doppler-vibrometer in combination with numerical simulations. First investigations are done on silicon membrane structures at production related conditions to determine the thickness of membrane. An outlook is given to apply this method for the determination of residual stresses in thin films at wafer level e.g. to characterise coating processes.