English
Deutsch
Log In
Log in with Fraunhofer Smartcard
Password Login
Research Outputs
Fundings & Projects
Researchers
Institutes
Statistics
Fraunhofer-Gesellschaft
Home
Fraunhofer-Gesellschaft
Konferenzschrift
Electronic packaging and multichip modules
Details
Full
Export
Statistics
Options
Show all metadata (technical view)
1995
Conference Paper
Title
Electronic packaging and multichip modules
Author(s)
Reichl, H.
Wolf, J.
Mainwork
Micro Materials, Micro Mat 1995. Proceedings
Conference
Conference Micro Materials (Micro Mat) 1995
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
